Laser Scribing – INNOLAS



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Key sample information

Maximum Sample Size: 20 cm x 20 cm

Materials

Silicon, perovskite, CIGS.

List can be extended upon request.

More information about PV material.

Practical information

Manufacturer: InnoLas
Model: P164
Minimum training time to use the machine: In-depth training

More information our training policy.

What is it for?

  • Picosecond pulsed laser (UV, Green, IR) necessary for silicon wafer opening pre-metallization. Silicon wafer cutting for dimension customization and modularization (e.g. shingle, half-cell modules).
  • Modularization – Scribing of perovskite solar cells to create interconnections within the cells (c.f – P1,P2,P3 pattern).
  • Edge isolation through ablation of perovskite materials
  • Further uses – any desired opening can be produced for optical characterization

How does it work?

  • Programming desired pattern through common python code
  • Insert laser input parameters such as power, number of passes, translation speed
  • Cell dimension is detected through a camera and aligned accordingly to allow the desired pattern to be produced on the physical cell

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